This brochure introduces Altair SimLab as a multiphysics simulation platform designed to create a complete 3D digital twin for 3D IC and advanced semiconductor packaging. It enables early “what-if” analysis across power integrity, electromagnetic behavior, thermal performance, and mechanical reliability within a single, unified workflow. SimLab supports heterogeneous integration technologies such as chiplets, wafer-level packaging, and 2.5D/3D IC architectures. Key capabilities include thermal-aware floorplanning, power pin optimization, stress and warpage analysis, and multithreaded performance for large-scale simulations. By identifying risks early, SimLab reduces costly redesigns, accelerates development cycles, and improves reliability for high-performance computing, AI, automotive, an

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