Making the Right Connections in 3D IC Design
Making the Right Connections in 3D IC Design
14 PagesSiemens SW's eBook "Making the Right Connections in 3D IC Design" explores advanced techniques for three-dimensional integrated circuit (3D IC) design. It emphasizes optimizing connections between stacked layers to improve performance and reduce power consumption. Key topics include design methodologies, interconnect strategies, and simulation tools for enhancing reliability. By leveraging Siemens SW's solutions, designers can navigate the complexities of 3D IC design effectively, achieving innovation and efficiency in semiconductor development.
