The text discusses the emergence of 3D IC technology, detailing its benefits, challenges, and solutions. It emphasizes the need for new design approaches due to the vertical stacking of components, requiring specialized tools for manufacturability and reliability assurance. Key challenges include handling interactions between diverse processes, modeling parasitics accurately, and selecting appropriate extraction methodologies. The choice between silicon and organic connectivity impacts design methodologies and tools, with each offering advantages and trade-offs in analysis complexity and accuracy.

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