Toshiba achieved significant product size reduction using 3D chip, package, board co-design in CR-8000 Design Force
Toshiba achieved significant product size reduction using 3D chip, package, board co-design in CR-8000 Design Force
5 PagesToshiba achieved significant product size reduction using 3D chip, package, board co-design in CR-8000 Design Force SUC CESS ST OR Y ZUKEN - T he P ar tner f or Suc c ess CR-8000 is a product-centric design solution that provides the tools to optimize a design at both the product and PCB design level. TMToshiba faced a difficult design problem: their TransferJetTM technology was embedded in a customer cell phone, and when the next rev of the phone came around, they learned that they needed to shrink the board from 8mm x 8mm to 4.5mm x 6mm, and they had to shrink the module thickness from 1.7mm to 1.0mm. The original design was a simple board with a wire bond package and several peripherals. Competitive pressures required a significant reduction in size and thickness. On top of t
