Thermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
Thermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance
6 PagesThermal Simulation Reduces IC Cost by Comparing Flip-Chip/Wire Bond Thermal Performance Early in the development process of a new dual-port 10 Gigabit Ethernet physical layer integrated circuit (IC), engineers at Applied Micro Circuits Corporation (AMCC®) faced a critical choice. The high performance chip presented thermal management challenges. AMCC engineers had to decide between a flip-chip package, which provides the optimal thermal
