Redesign of Packaging Area Improves Throughput 27% Challenge The additional packaging volumes flowing through the Chattanooga DC were much higher than the customer expected, exceeding forecast by 35%. As a result, the existing VAS area layout and product flow design were suboptimal for the new volumes and the area was becoming overwhelmed. Kenco leveraged its corporate engineering team to conduct an emergency assessment and implement changes to improve throughput and meet the customer’s productivity goals. Solution The engineering team identified several “quick hit” improvements that could be made with minimal disruption to the packaging operation. They redesigned the packaging area into small, one- to two-person work cells. They removed unnecessary rollers that were now inhibiting product

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