Ball grid arrays (BGAs) and quad-flat no-lead (QFN) interconnections are two features of PCBAs that require close inspection. A challenge when inspecting modern BGAs in particular is that they have become very complex, with tighter pitches and smaller ball diameters. It means they are mounted so close to the body of the PCB that there is little space between them to enable visual inspection. Newbury Electronics (www.newburyelectronics.co.uk)

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