Power semiconductor devices are used for switching high currents and voltages and are widely used in the rail, wind turbine, mining and petrochemical sectors. Press-Pack capsules are clamped together under high pressure to achieve the required electrical rating, whereas isolated power modules use integrated circuit on DCB (direct copper bonded) substrate technology. The Nikon Metrology XT V 160 is needed because the reflowed solder, which attaches the chips to their contact pads, must be continuous with a controlled level of voids and X-raying is the only way to see if these conditions have been met. Fiona Lambert, Process Engineer at IXYS UK Westcode commented, "I previously used a smaller Nikon 130 kV X-ray quality assurance (QA) system when I worked at an electronics company

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