POREX® Tubular Membrane Filter (TMF)™ Applied in Backgrinding and Die Sawing Wastewater Reclaim System for an Integrated Circuit Packaging Plant in Su
POREX® Tubular Membrane Filter (TMF)™ Applied in Backgrinding and Die Sawing Wastewater Reclaim System for an Integrated Circuit Packaging Plant in Su
6 PagesPOREX FILTRATION CASE STUDY Page 1 of 6 POREX ® Tubular Membrane Filter (TMF) ™ Applied in Backgrinding and Die Sawing Wastewater Reclaim System for an Integrated Circuit Packaging Plant in Suzhou,China. Backgrinding and die sawing are two steps in the Integrated Circuit (IC) packaging process. For easier transportation and protection of the wafer, the thickness of the industrially produced wafer is larger than required. Therefore, befor
