Case Study

Investigating the Effect of Solder Geometry and Board Boundry Conditions on Solder Thermal Fatigue

Investigating the Effect of Solder Geometry and Board Boundry Conditions on Solder Thermal Fatigue

Pages 4 Pages

Tony A. Asghari Continental Automotive / Quality – Reliability Physics Team CASE STUDY / Investigating the Effect of Solder Geometry and Board Boundry Conditions on Solder Thermal Fatigue2 Investigating the Effect of Solder Geometry and Board Boundry Conditions on Solder Thermal Fatigue // / Approach Continental engineers imported their baseline model into Sherlock. This took the form of an ODB++ file that came from their ECAD designers. In a matter of seconds, Sherlock interpreted this data and built a detailed model of their PCBA. The data contained the stack-up layer in the PCBA and could be viewed individually as well as combined to see the overall properties of the board. Sherlock also populated all the data for each component on the board with the location, size and properti

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