Tony A. Asghari Continental Automotive / Quality – Reliability Physics Team CASE STUDY / Ansys Sherlock for Predicting Thermal Stress Fatigue in Solder Balls – Continental Automotive2 Ansys Sherlock for Predicting Thermal Stress Fatigue in Solder Balls – Continental Automotive // / Approach To begin the Sherlock analysis, engineers at Continental imported a Zuken ODB++ file into Sherlock. Sherlock was able to quickly read all the information in this file and generate a representative board with complete stackup data, all components and mounting conditions with their location and material characteristics. The board featured some mirrored BGA components, where the board had BGAs placed in the same location on both the top and bottom sides of the board. Both sides of the board also ha

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