Case Study

Auburn University

Auburn University

4 SIMULIA Realistic Simulation News September/October 2011 www.simulia.com copper-reinforced solder column package architectures using advanced finite element techniques such as cohesive element modeling for both ceramic (CBGA) and plastic (PBGA) packages. Previous modeling methods used to overcome the length-scale issues between individual interconnects and the package for shock and drop simulation include smeared property models, bea

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