DS PLM SUCCESS STORY Advanced Micro Devices Improving reliability of flip-chips with Abaqus FEA from SIMULIA Challenge Advanced Micro Devices (AMD) needed a way to predict and prevent crack formation and delamination in the flip-chip version of its integrated circuits Solution AMD chose Abaqus FEA from SIMULIA to study the effects various underfill design variables Benefits Thanks to complex studies conducted with Abaqus FEA, AMD came

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