Intel’s upcoming Xeon “Clearwater Forest” (2025) leverages Intel 18A process and advanced packaging to deliver high-performance, power-efficient CPUs for AI-era data centers. Key technologies include RibbonFET transistors for superior efficiency, PowerVia backside power delivery, and Foveros Direct 3D hybrid bonding for dense chip stacking. EMIB 3.5D enables scalable, heterogeneous chiplet integration, while cost-optimized FCBGA 2D+ packaging reduces expenses. The mix-and-match chiplet approach improves yield, shortens design cycles, and allows reuse of proven IP, creating flexible architectures that boost performance, scalability, and efficiency.

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