Samtec’s AI/ML Solutions Guide presents high-performance interconnect systems tailored for next-gen AI and ML architectures requiring extreme speeds, density, and signal integrity. It highlights solutions for AI chipsets, accelerators, embedded systems, and domain-specific applications like NLP and computer vision. Offerings include Flyover® cable systems, AcceleRate® arrays, rugged/power modules, optics, and precision RF connectors, all optimized for compact form factors and harsh environments. Supporting data rates up to 224 Gbps, these interconnects enable scalable, low-latency performance across edge AI, HPC, and embedded platforms with extensive design flexibility and ecosystem compatibility.

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