The HPE Cray Supercomputing EX solution (2025) delivers over half of the computing power of the world’s Top 100 supercomputers. It combines fanless liquid cooling, advanced software, powerful AMD and NVIDIA processors, and high-speed HPE Slingshot interconnects to enable breakthrough performance, energy efficiency, and scalability. Supporting scientific modeling, AI, and data analytics, it offers modular, future-proof architecture with superior throughput and reliability. Designed for national labs, AI centers, defense, weather forecasting, and industries like energy and aerospace, it accelerates innovation while optimizing costs.

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