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XJTAG boundary scan fast-tracks solution for testing complex, high-density boards

XJTAG boundary scan fast-tracks solution for testing complex, high-density boards

XJTAG
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Recently, the manufacturing division from Linkra Networks engaged IPSES to develop a test solution for complex and densely populated computing boards containing over 20,000 solder joints and with around 5500 connection nets. Linkra had envisaged a strategy based on in-circuit testing. IPSES proposed a faster and more cost effective solution using boundary scan to test the majority of the board’s connections. “The cost of building a fixture and de

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