Wire Bonding (SSMI-01) | Celera Motion Wire Bonding (SSMI-01) As the high-tech sector continues to demand better, faster wire bonds, each new generation of wire bonder is also expected to accommodate an ever-smaller footprint on production floors. More than ever, wire bonds need to be placed closer together and with a more consistent and predictable three- dimensional wire path. Higher placement accuracy is also required due to smaller bond pad size and increased pad density in high end product. In order to achieve these ends, a wire bonder’s motion control system needs to have the best possible control of velocity, acceleration and the third order derivative of position (a.k.a. “jerk”), with high speed positioning, excellent repeatability and high resolution. The motion feedback encode

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