Thermal Analysis, Heat Sink Design and Performance Verification for GE Fanuc Intelligent Platform’s WANic 3860 Packet Processor PCI Card
Thermal Analysis, Heat Sink Design and Performance Verification for GE Fanuc Intelligent Platform’s WANic 3860 Packet Processor PCI Card
5 PagesCASE STUDY 89-27 ACCESS ro Ad, nor Wood , mA 02062 USA | t: 781.769. 2800 f: 781.769.9979 | WWW.QA tS.Com Thermal Analysis, Heat Sink Design and Performance Verification for GE Fanuc Intelligent Platform’s WANic 3860 Packet Processor PCI Card Challenge When GE Fanuc Intelligent Platforms, a leading provider of embedded computing solu- tions for a wide range of industries and applications, needed to determine the thermal characteristics of t
