Case Study

Semiconductor Wearout Life Prediction Risk Factors Mitigated

Semiconductor Wearout Life Prediction Risk Factors Mitigated

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1 Semiconductor Wearout Life Prediction // A major auto manufacturer was concerned with the reliability of semiconductor components that are part of a printed circuit board assembly PCBA housed inside a transmission controller under the hood. The unit is exposed to extreme conditions such as high temperature and humidity from heat generated while running and solar heating while parked. The auto manufacturer requested a wearout life prediction analysis on potential high-risk components. / Approach Ansys Reliability Engineering Services (RES) first ran a reliability analysis using Ansys Sherlock simulations on separate semiconductor components that comprise the PCBA, including several components in different technology nodes. These simulations were used to predict the lifetime of the

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