lifecycle, you need to see and analyze the connection of hidden solder joints underneath bottom-terminated components. Traditionally, the electronics manufacturing industry has relied on manual visual inspection, or 2D X-ray systems, to determine whether or not a connection is acceptable. Unfortunately, both of these methods are highly unreliable and completely subjective. It’s been shown that without an accurate picture of what’s going on underneath the component packages, technicians won’t always agree on what constitutes an appropriate solder joint. To remove the subjectivity of measuring accurate connections in leadless components, Saline Lectronics recently invested in a Nikon XT V 160 with a Varian 1313Dx fl at panel detector and X.Tract technology. Upgrading from a 2D X-

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