Case Study
Platform Engineering for North American Semiconductor Vendor
Platform Engineering for North American Semiconductor Vendor Customer: North American Semiconductor Tier-1 Scope Customer was seeking a partner for supporting multiple customers on feature enhancements and maintenance activities for the automotive-grade chipsets running QNX, AGL, and Android Solution Sasken is responsible for the following activities: Feature enhancements and maintenance of the following components on Android and QNX: Platform: Linux Kernel, BSP, Vehicle N/W (CAN, USB) Multimedia (audio, video, camera), device drivers Application framework Graphics Display subsystem Apply AOSP and security patches on the chipset platforms Functional, sanity, stability, regression, KPI tests & CTS Carryout build and integration activity for releases Handle customer queries and defects on