Customer: Tier-1 Rugged Device OEM Next Gen Rugged device platform development for Tier-1 OEM Scope Android M NPI platform (MSM8956) for lead and multiple derivatives for NA and other operator markets Solution BSP and Modem Bringup Qualcomm Reference board validation and benchmarking HW revisions bringup support Lead and derivative BSP bringup with kernel, peripherals, sensors on Android M Modem bring up, stabilization and certication for retail and NA variants Middleware Bringup – Ethernet, DHCP, NFC, Multimedia (Camera/Audio/Video) Integration of OEM Specic customizations, including Scanner and Camera Google GMS pre-certication testing and defect xing System, Stability, Power, Performance, memory testing with automation Regulatory and Operator Certication pre-cert and Certication s

Join for free to read