New Plastics Offer Effective Thermal Transport and Heat Spreading Challenge Heat buildup is a significant problem and limiting design factor for many electronic products. For example, LEDs are emerging as the next generation lighting materials due to their low power utilization and long life. Some lamps have multiple LEDs within an enclosure, which generates undesirable heat during operation. It is important to dissipate this heat efficiently to ensure proper operation of the device, enhance brightness, increase lifetime and prevent fogging. Traditionally, heat-sink materials have been made of metal such as aluminum and formed into the proper design shape for the most efficient convective heat transfer. However, these metal components add significant weight and other design limitations fo

Join for free to read