This Molded Rotor component by Accumold meets the demanding high temperature requirements for lead-free soldering. RTP 3400 Series Liquid Crystal Polymer compound was selected for this challenging application which involved shutting-off around the lead frame without interfering with the function of the part. To mold this component, Accumold built two 8-cavity systems with 100% fiber-optic inspection. Lead-Free Soldering RTP Company End-Use Case Study High Temperature Compounds Meet Challenges in the Electrical/Electronic Industry The primary challenge in this transition is adapting to the higher temperatures that are required in the lead-free soldering process. Components exposed to lead-free solder alloys must be capable of withstanding temperatures of 260 °C or greater. Impacted the most

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