EDA Solutions, 58 Botley Road, Park Gate, Southampton, SO31 1BB, UK T: +44 (0) 1489 564253 F: +44(0) 1489 557367 E: info@eda-solutions.com W: www.eda-solutions.com Micro-electromechanical systems (MEMS) represent a highly cost-effective way of building tiny sensors and actuators. But a major problem with MEMS devices is that they need to be hermetically sealed: a level of protection much higher than that generally used for integrated-circuit packaging. As they can measure as little as 1mm on a side, handling MEMS devices is extremely dif?cult and the use of conventional packaging techniques can damage the delicate MEMS structures. The alternative is to perform packaging at the wafer level. Hymite is a specialist that has developed a way of providing hermetically sealed packag

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