SEMICONDUCTORS AND SOLAR APPLICATION NOTE 5.00.04 PEROXIDE BLENDING AND DISPENSE AT CMP w w w . k p a t e n t s . c o m HYDROGEN PEROXIDE, H 2 O 2 Typical end products Silicon wafers Chemical curve: Hydrogen peroxide R.I. per Conc% b.w. at Ref. Temp. of 20°C Introduction Chemical mechanical planarization (CMP) is the process of smoothing and polishing the wafer surface. This is done with the aid of an oxidising

Join for free to read