Success Story – High Heat Flux Direct Expansion Subsystem Aspen was approached by a new customer with a unique cooling requirement. This customer required a cooling subsystem which would provide a high heat flux (150 W) to a cold plate mounted on a small chip (approximately 2 x 2 in.). The application also required a solution which would cool the cold plate to very low temperatures (-30°C) in order to respond quickly when the heat load was applied. The heat source was to be located remotely from the core of the cooling solution and the connecting lines needed to allow movement of the cold plate. In addition to performance, size, weight, and reliability were all critical for the end application. Breadboard Proof of Concept During the first step of this program the customer and Aspen resolve

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