extra cooling capacities Case study - Cassette PRO Use the side panels with cooling fins. Use the FHC to guide the heat from the hot spot of the PCB through the FHC and the side panel. Reduction of the processor surface temperature by approx. -10 to 12°C. ©2018 nVent. All nVent marks and logos are owned or licensed by nVent Services GmbH or its affiliates. All other trademarks are the property of their respective owners. nVent reserves the right to change specifications without notice. Project Number 20160081 nVent.com/SCHROFF Our powerful portfolio of brands: CADDY ERICO HOFFMAN RAYCHEM SCHROFF TRACER Project Details Location Germany Type of system Electronic application (Test & Measurement) Technology Standard Cassette IEC 60297-3-101...103 Product scope Series Date/Time frame 02 /

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