Boosting The PerformanceLED Semiconductor Die-Bonding Machine
Boosting The PerformanceLED Semiconductor Die-Bonding Machine
2 PagesSuccess Story Boosting the Performance LED Semiconductor Die-Bonding Machine Elmo increases machine throughput and accuracy to speed manufacturing The Background The Challenge The Solution Elmo was challenged to produce a motion control solution that would achieve: 90-degree PTP motion in 40 msec Settling time to ±25 counts in 5 msec Gold Drum Servo Drive 11-390 VDC Up to 11.2 Kw DDR motor shaft connection to the rotational load The company
