CASE STUDY ADVANCED MULTI-LAYER PCB FOR HIGH-END COMPUTING APPLICATION THE CHALLENGES Very high-speed, high density PCBs are a challenge due to several often conflicting requirements including: size constraints, routing, fanout from high pincount BGA’s and signal integrity. Making the wrong design, process or materials choices can result in less than optimum performance. A leading OEM needed advanced PCBs for their next generation, high-

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