Case Study

Advance Tech Communications

Advance Tech Communications

Pages 1 Pages

Advance Tech has used System-on- Silicon (SoS) and Multi-Chip Module (MCM) technologies to pack this powerful and diverse functionality within overall dimensions of 125mm x 70mm x 32mm. The PCB is as dense as M.A.G.I.C.Shiv1’s features are rich, and adequate test coverage is not possible using conventional probe- based testers alone. To overcome the testability challenges, the Advance Tech team decided to use boundary scan from early development

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